Physical Vapor Deposition (PVD)

PVD is a process of condensing thin film layers of metals, their oxides, their nitrides or combinations onto a glass substrate.

Sputtering Theory:

• Positive Ar ions are accelerated to the negatively charged cathode and hit the target surface with high energy
• The target atoms are deposited as a coating on thesubstrate with good uniformity, reproducibility and adhesion.
• The secondary electrons produce new Ar ions by collision.
• Introducing O2 or N2 to the coating chamber atmosphere allows deposition of either metal-oxide or metal-nitride films.

substrate with good uniformity, reproducibility and adhesion.

• The secondary electrons produce new Ar ions by collision.
• Introducing O2 or N2 to the coating chamber atmosphere allows deposition of either metal-oxide or metal-nitride films.

Magnetron Sputtering:

• A series of magnetic fields are introduced into the sputter chamber to increase electron density near the target.
• Consequently argon ions near the cathode are increased resulting in a faster sputtering rate.