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Advantages of Sputter Technology

Home / Advantages of Sputter Technology
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Physical Vapor Deposition (PVD)

PVD is a process of condensing thin film layers of metals, their oxides, their nitrides or combinations onto a glass substrate.

Sputtering Theory:

  • Positive Ar ions are accelerated to the negatively charged cathode and hit the target surface with high energy
  • The target atoms are deposited as a coating on thesubstrate with good uniformity, reproducibility and adhesion.
  • The secondary electrons produce new Ar ions by collision.
  • Introducing O2 or N2 to the coating chamber atmosphere allows deposition of either metal-oxide or metal-nitride films.

substrate with good uniformity, reproducibility and adhesion.

  • The secondary electrons produce new Ar ions by collision.
  • Introducing O2 or N2 to the coating chamber atmosphere allows deposition of either metal-oxide or metal-nitride films.

Magnetron Sputtering:

  • A series of magnetic fields are introduced into the sputter chamber to increase electron density near the target.
  • Consequently argon ions near the cathode are increased resulting in a faster sputtering rate.
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